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Patent Searching and Data


Title:
SUBSTRATE DETECTING SENSOR AND SUBSTRATE SUCTION-ATTACHMENT PAD EMPLOYING SAME
Document Type and Number:
WIPO Patent Application WO/2016/207997
Kind Code:
A1
Abstract:
This substrate detecting sensor (1) is provided with a coil (2) forming an LC circuit, an oscillator circuit (4) which supplies an electric current to the coil (2), a detecting circuit (3) which detects variations in the inductance of the coil (2), and a CPU (6) which, on the basis of results from the detecting circuit (3), analyzes count information relating to the number of substrates in close proximity to the coil (2). The detecting circuit (5) detects, as variations in the inductance, resonant frequency variations which arise when a high-frequency magnetic flux generated as a result of the electric current flowing through the coil (2) varies. The CPU (6) stores in advance the inductance of the coil (2), as reference values corresponding to the number of substrates, and analyzes the substrate count information by comparing the inductance of the coil (2) as detected by the detecting circuit (5) with the reference values.

Inventors:
TERASHIMA HAJIME (JP)
Application Number:
PCT/JP2015/068158
Publication Date:
December 29, 2016
Filing Date:
June 24, 2015
Export Citation:
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Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
H01L21/67; B25J15/06; H05K13/02
Domestic Patent References:
WO2014156276A12014-10-02
Foreign References:
JP2002174502A2002-06-21
JPH0248196A1990-02-16
JP2001267400A2001-09-28
Attorney, Agent or Firm:
ARAI, Shigeto (JP)
Shigeto Arai (JP)
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