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Patent Searching and Data


Title:
SUBSTRATE LOADING/UNLOADING DEVICE AND SUBSTRATE LOADING/UNLOADING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/123402
Kind Code:
A1
Abstract:
A substrate loading/unloading device for unloading a substrate from a tray and loading a substrate onto a tray. A palette is positioned at a predetermined position on a conveyor, and in this state with the palette positioned, a palette lifting means holds trays, from among stacks of trays on the palette, which are a tray to be loaded/unloaded and a tray not to be processed that is placed on the stage above the tray to be loaded/unloaded, and the palette lifting means moves the held trays vertically. A substrate separation pin is installed on the tray lifting means, and the pin is caused to enter into a space below the tray to be loaded/unloaded, thereby a substrate is separated from the tray to be loaded/unloaded. With the substrate separation pin positioned in the space below the tray to be loaded/unloaded, the pin is inserted into an insertion hole in the tray to be loaded/unloaded. Then, the substrate is lifted by the substrate separation pin, and thus the substrate can be taken out.

Inventors:
Kamichika, Tetsuro c/o HIRATA CORPORATION (9-20 Togoshi 3-chom, Shinagawa-ku Tokyo 41, 14200, JP)
Application Number:
PCT/JP2005/008991
Publication Date:
November 23, 2006
Filing Date:
May 17, 2005
Export Citation:
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Assignee:
HIRATA CORPORATION (9-20, Togoshi 3-chome Shinagawa-ku, Tokyo 41, 14200, JP)
Kamichika, Tetsuro c/o HIRATA CORPORATION (9-20 Togoshi 3-chom, Shinagawa-ku Tokyo 41, 14200, JP)
International Classes:
B65G49/06; H01L21/68
Attorney, Agent or Firm:
Ohtsuka, Yasunori (7th FL, Shuwa Kioicho Park Bldg. 3-6, Kioich, Chiyoda-ku Tokyo 94, 10200, JP)
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