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Title:
SUBSTRATE DICING JIG, PROCESSING APPARATUS, AND SUBSTRATE DICING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/100149
Kind Code:
A1
Abstract:
The present invention concerns a substrate dicing jig used for dicing circuit substrates, a processing apparatus and a dicing method, and has as a goal realizing highly efficient and high quality substrate dicing. A substrate dicing jig (100) is used that is provided with the following: a plurality of suction holes (12, 13) that attach by vacuum pressure a circuit substrate (200) and that are formed in a loading surface (11) for loading the circuit substrate (200) which has mounted thereon a plurality of elements; a plurality of laser beam receiving grooves (15) that are for receiving laser beams and that formed in the loading surface (11) along the sweep lines of the laser beams applied to the circuit substrate (200) for dicing the circuit substrate (200); and suction holes (16) that are formed so as to communicate with each of the laser beam receiving grooves (15) and that suction the melted material of the circuit substrate (200) resulting from the dicing of the circuit substrate (200).

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Inventors:
KAYAHARA TAKASHI (JP)
SHIGEMATSU TAKASHI (JP)
SAKAI TOSHIAKI (JP)
YAGI SABURO (JP)
OSHIMA HIROFUMI (JP)
FUJISAKI AKIRA (JP)
EMORI YOSHIHIRO (JP)
Application Number:
PCT/JP2012/084217
Publication Date:
July 04, 2013
Filing Date:
December 28, 2012
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
KAYAHARA TAKASHI (JP)
SHIGEMATSU TAKASHI (JP)
SAKAI TOSHIAKI (JP)
YAGI SABURO (JP)
OSHIMA HIROFUMI (JP)
FUJISAKI AKIRA (JP)
EMORI YOSHIHIRO (JP)
International Classes:
B23K26/10; B23K26/00; B23K26/16; B23K26/38; H01L21/56; H05K3/22
Foreign References:
JP2008137016A2008-06-19
JPH04139786A1992-05-13
JP2001053443A2001-02-23
JP2001347433A2001-12-18
JP2002324768A2002-11-08
JP2003002677A2003-01-08
JP2007090508A2007-04-12
JP2007320124A2007-12-13
JP2008229682A2008-10-02
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (JP)
Hiroaki Sakai (JP)
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Claims:



 
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