Title:
SUBSTRATE DIPPING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/182107
Kind Code:
A1
Abstract:
The present invention relates to a substrate dipping device and, more particularly, to a substrate dipping device which uniformly fills nanoparticles into grooves formed on a substrate by dipping the substrate at a constant angle with respect to the surface of a solution at a constant speed. The present invention comprises: a body (100) which has an internal plate (110) thereinside and has a support plate (120) on the internal plate (110); a crucible (200) which contains an aqueous solution (210) thereinside and is provided on the support plate (120); a crucible drive unit (300) which is provided inside the body (100) and is configured to be coupled to the crucible (200) so as to move the crucible (200) in the right and left directions or in the up and down directions of the body (100); a support (400) formed so as to fix a substrate (410) at the lower end thereof; a support drive unit (500) which is provided on one upper side of the body (100) and is configured to be coupled to the support (400) so as to drive the support (400) in the longitudinal direction of the support (400) or rotate the support (400) in the up and down directions of the body (100); and a control unit which is coupled to the crucible drive unit (300) and the support drive unit (500) to control the operation of the crucible drive unit (300) and the support drive unit (500).
Inventors:
YOU EUN-AH (KR)
Application Number:
PCT/KR2015/004992
Publication Date:
November 17, 2016
Filing Date:
May 19, 2015
Export Citation:
Assignee:
KOREA RES INST STANDARDS & SCI (KR)
International Classes:
B05C3/02; B05C13/02
Foreign References:
| KR100830173B1 | 2008-05-16 | |||
| EP0857516A2 | 1998-08-12 | |||
| KR101401122B1 | 2014-05-29 | |||
| KR20130009601A | 2013-01-23 | |||
| JPH05208156A | 1993-08-20 |
Attorney, Agent or Firm:
PLUS INTERNATIONAL IP LAW FIRM (KR)
특허법인 플러스 (KR)
특허법인 플러스 (KR)
Download PDF: