SUBSTRATE DIVIDING SYSTEM, SUBSTRATE MANUFACTURING EQUIPMENT, SUBSTRATE SCRIBING METHOD AND SUBSTRATE DIVIDING METHOD

WIPO Patent Application WO/2005/087458

A1

A substrate dividing system, which is compact with a small installation area and can efficiently divide a substrate. A clamping apparatus (50) is provided to hold at least one side edge part of a mother board carried into a hollow rectangular parallelepiped mount (10) and is permitted to reciprocate along one side of the hollow rectangular parallelepiped mount (10). A pair of substrate dividing apparatuses for dividing the mother substrate clamped by the clamping apparatus (50) from the upper plane and the lower plane of the mother substrate, respectively, are provided on a dividing apparatus guide body (30) so as to move along a direction orthogonally intersecting with a moving direction of the clamping apparatus (50). At the time of moving the clamping apparatus (50) which is holding the mother substrate, the substrate supporting apparatus supports the mother substrate without sliding on the mother board.

NISHIO YOSHITAKA (JP)
OKAJIMA YASUTOMO (JP)
OSHIMA YUKIO (JP)
OHNARI HIROYUKI (JP)
YOSHIMOTO KAZUHIRO (JP)

PCT/JP2005/004478

September 22, 2005

March 14, 2005

Click for automatic bibliography generation  

MITSUBOSHI DIAMOND IND CO LTD (JP)
NISHIO YOSHITAKA (JP)
OKAJIMA YASUTOMO (JP)
OSHIMA YUKIO (JP)
OHNARI HIROYUKI (JP)
YOSHIMOTO KAZUHIRO (JP)

B26F3/00; B27B5/06; B28D1/04; B28D5/02; B65G49/06; C03B33/023; C03B33/027; C03B33/03; (IPC1-7): B26F3/00

JPH10209086A	1998-08-07
JP2000264657A	2000-09-26
JP2001347497A	2001-12-18

Yamamoto, Shusaku (Crystal Tower 2-27, Shiromi 1-chome, Chuo-k, Osaka-shi Osaka 15, JP)

View/Download PDF      PDF Help

Previous Patent: METHOD AND DEVICE FOR PRODUCING PORTIONS

Next Patent: METHOD AND PLANT FOR SAWING A LOG