SUBSTRATE DRYING DEVICE AND SUBSTRATE DRYING METHOD

WIPO Patent Application WO/2004/070805

A1

A substrate drying device and a substrate drying method, wherein in drying treatment, the upper part of a treating tank (35) is closed by an openable cover member (37) to seal the treating tank (35) so that a substrate (W) can be conveyed by a third conveying mechanism over the treating tank (35) even during the drying treatment, and a system drying the substrate (W) by sucking the substrate (W) from the suction holes of a substrate holding part (39) by using dry air supplied from the upper side of the substrate (W) is adopted to provide a compact drying treatment part (17) capable of rapidly drying the substrate (W) without generating water marks. Thus, the substrate drying device capable of rapidly drying the substrate without adhering particles and generating the water marks and suitably usable for compact devices though adopting a system which dries the substrate by using gas supplied from the upper side of the substrate can be provided together with the substrate drying method.

OKUMURA KATSUYA (JP)
MUNAKATA HIDEKI (JP)
NETSU SHIGEYOSHI (JP)
ITO TATSUO (JP)
MURAOKA YUSUKE (JP)
ABIKO YOSHITAKA (JP)
FUJIKAWA KAZUNORI (JP)

PCT/JP2004/001059

August 19, 2004

February 03, 2004

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SHINETSU HANDOTAI KK (JP)
OKUTECH CO LTD (JP)
DAINIPPON SCREEN MFG (JP)
OKUMURA KATSUYA (JP)
MUNAKATA HIDEKI (JP)
NETSU SHIGEYOSHI (JP)
ITO TATSUO (JP)
MURAOKA YUSUKE (JP)
ABIKO YOSHITAKA (JP)
FUJIKAWA KAZUNORI (JP)

F26B5/12; H01L21/00; H01L21/02; H01L21/304; (IPC1-7): H01L21/304; F26B5/12

JPH04287321A	1992-10-12
JPH0888210A	1996-04-02
JPH10154687A	1998-06-09
JP2002329704A	2002-11-15
JP2003031543A	2003-01-31

Yoshimiya, Mikio (6-4 Motoasakusa 2-chom, Taito-ku Tokyo, JP)

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