Title:
SUBSTRATE FOR ELECTRONIC COMPONENTS, LIGHT EMITTING DEVICE, AND PRODUCTION METHOD FOR SUBSTRATE FOR ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2010/095482
Kind Code:
A2
Abstract:
Disclosed is a substrate for electronic components which enables improved heat dissipation. The substrate for electronic components is provided with a metallic frame (2), which has frame parts 2a and 2b which are electrically insulated from each other, and wherein an LED (1) is mounted on frame part 2a; and a reflective frame (3) which is disposed on the frame (2). In order for frame part 2a to directly contact the reflective frame (3), and for frame part 2b to not directly contact the reflective frame (3), the frame (2) and the reflective frame (3) are fixed to each other by means of a resin member (6).
Inventors:
OMAE MITSUHIRO (JP)
Application Number:
PCT/JP2010/050498
Publication Date:
August 26, 2010
Filing Date:
January 18, 2010
Export Citation:
Assignee:
SANYO ELECTRIC CO (JP)
OMAE MITSUHIRO (JP)
OMAE MITSUHIRO (JP)
International Classes:
H01L33/64
Domestic Patent References:
| WO2006016398A1 | 2006-02-16 |
Foreign References:
| JP2004214436A | 2004-07-29 | |||
| JP2008235867A | 2008-10-02 | |||
| JP2007002096A | 2007-01-11 | |||
| JPH0997928A | 1997-04-08 | |||
| JP2005039100A | 2005-02-10 | |||
| JP2006332618A | 2006-12-07 |
Attorney, Agent or Firm:
Hiroshi Sumiya (JP)
KADOYA HIROSHI (JP)
KADOYA HIROSHI (JP)
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