SUBSTRATE, ELECTRONIC DEVICE, BONDING STRUCTURE AND BONDING METHOD THEREFOR

Title:

SUBSTRATE, ELECTRONIC DEVICE, BONDING STRUCTURE AND BONDING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2019/205150

Kind Code:

A1

Abstract:

Disclosed is a substrate, comprising a base plate and at least one bonding portion provided on the base plate, the bonding portion being a partial Archimedes screw structure. As the bonding portion on the substrate is a partial Archimedes screw structure, the substrate can be rotationally adjusted to avoid the problem of misalignment of bonding portion on the substrate due to factors such as thermal expansion, improving the alignment accuracy of the substrate, further improving the bonding progress of the substrate. The present invention further provides an electronic device, a bonding structure and a bonding method therefor.

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Inventors:

XU ZHIGAO (CN)
SHEN HEWEN (CN)

Application Number:

PCT/CN2018/085115

Publication Date:

October 31, 2019

Filing Date:

April 28, 2018

Export Citation:

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Assignee:

SHENZHEN ROYOLE TECHNOLOGIES CO LTD (CN)

International Classes:

H01L23/488; H01L23/48

Foreign References:

CN103983688A	2014-08-13
US20120251757A1	2012-10-04
CN206608789U	2017-11-03
CN102364679A	2012-02-29

Attorney, Agent or Firm:

SCIHEAD IP LAW FIRM (CN)

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