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Title:
SUBSTRATE FOR ELECTRONIC ELEMENT MOUNTING, ELECTRONIC DEVICE AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/207884
Kind Code:
A1
Abstract:
The present invention comprises a substrate which has a first surface and a second surface that is positioned on the reverse side of the first surface. The substrate has a first recess which is positioned in the first surface, and a second recess which is positioned in the second surface. The substrate has an electrode pad. The electrode pad is positioned in the first recess. The first recess and the second recess are at a distance from each other when the substrate is viewed in plan.

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Inventors:
TAKESHITA FUMIAKI (JP)
NONOYAMA TERUAKI (JP)
Application Number:
PCT/JP2019/003377
Publication Date:
October 31, 2019
Filing Date:
January 31, 2019
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/15; H01L23/12; H05K1/02
Foreign References:
US20090200650A12009-08-13
JPH06302709A1994-10-28
JP2006253600A2006-09-21
US6818978B12004-11-16
JP2017034138A2017-02-09
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