Title:
SUBSTRATE EQUIPPED WITH MULTI-LAYER REFLECTION FILM, REFLECTION-TYPE MASK BLANK, REFLECTION-TYPE MASK, AND SEMICONDUCTOR DEVICE MANUFACTURING PROCESS
Document Type and Number:
WIPO Patent Application WO/2019/078205
Kind Code:
A1
Abstract:
Provided are: a multi-layer reflection film-equipped substrate that is capable of preventing contamination of the surface of the multi-layer reflection film even when a reference mark is formed on the multi-layer reflection film; a reflection-type mask blank; a reflection-type mask; and a semiconductor device manufacturing process. This multi-layer reflection film-equipped substrate 10 comprises: a substrate 12; a multi-layer reflection film 14 which is formed on the substrate 12 so as to be capable of reflecting EUV light; and a protective film 18 formed on the multi-layer reflection film 14. The protective film 18 has an indented reference mark 20 formed in the surface thereof. At least one of the chemical elements contained in the protective film 18 is identical to an element contained in a superficial layer 22 of the reference mark 20. The reference mark 20 has, at a bottom section thereof, a shrink region 24 that is formed as a result of the shrinking of at least one of the multiple films included in the multi-layer reflection film 14.
Inventors:
HAMAMOTO KAZUHIRO (JP)
SHOKI TSUTOMU (JP)
IKEBE YOHEI (JP)
SHOKI TSUTOMU (JP)
IKEBE YOHEI (JP)
Application Number:
PCT/JP2018/038499
Publication Date:
April 25, 2019
Filing Date:
October 16, 2018
Export Citation:
Assignee:
HOYA CORP (JP)
International Classes:
G03F1/22; G03F1/84; G03F7/20
Domestic Patent References:
| WO2013031863A1 | 2013-03-07 | |||
| WO2017169973A1 | 2017-10-05 |
Foreign References:
| JP2010219445A | 2010-09-30 | |||
| JP2017075997A | 2017-04-20 | |||
| JP2017058666A | 2017-03-23 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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