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Patent Searching and Data


Title:
SUBSTRATE FOR FLEXIBLE DEVICES AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/080765
Kind Code:
A1
Abstract:
The objective of the present invention is to obtain a substrate for flexible devices, which has good moisture barrier resistance and good adhesion of an insulating layer. A substrate (11) for flexible devices according to the present invention has a configuration wherein an Ni plating layer (13) is formed on the surface of a metal base (12) and a glass layer (14) is formed on the surface of the Ni plating layer (13). Consequently, there can be obtained a lightweight and flexible substrate (11) for flexible devices, in which glass exhibiting excellent moisture barrier resistance and excellent adhesion to the metal base (12) is laminated. In addition, since electrically insulating bismuth-based glass is laminated as the glass layer (14), this substrate (11) for flexible devices has excellent insulating properties and planarity, and can be used as a substrate for organic EL devices.

Inventors:
NISHIYAMA SHIGEYOSHI (JP)
SHIMOMURA HIROSHI (JP)
Application Number:
JP2013/080094
Publication Date:
May 30, 2014
Filing Date:
November 07, 2013
Export Citation:
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Assignee:
TOYO KOHAN CO LTD (JP)
TOKAN MATERIAL TECHNOLOGY CO LTD (JP)
International Classes:
H05B33/02; B32B15/04; C25D7/00; H01L51/42; H01L51/50
Domestic Patent References:
WO2012067146A12012-05-24
Foreign References:
JP2008243772A2008-10-09
JP2012133944A2012-07-12
JPH062104A1994-01-11
JP2004171806A2004-06-17
JP2011097007A2011-05-12
JP2006080370A2006-03-23
Other References:
See also references of EP 2925089A4
Attorney, Agent or Firm:
HIRAKI Yusuke et al. (JP)
Yusuke Hiraki (JP)
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