Title:
SUBSTRATE FOR FORMING TRANSPARENT CONDUCTIVE LAYER, TRANSPARENT CONDUCTIVE FILM, TOUCH PANEL, AND METHOD FOR MANUFACTURING SUBSTRATE FOR FORMING TRANSPARENT CONDUCTIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2020/122114
Kind Code:
A1
Abstract:
Provided are a substrate for forming a transparent conductive layer which exhibits excellent adhesion to a transparent conductive layer to be stacked and has excellent scratch resistance, a method for manufacturing the same, and a transparent conductive film and a touch panel using the same. A substrate 10 for forming a transparent conductive layer includes a substrate film 12 and a first resin layer 14 which is formed on a surface of the substrate film 12, wherein the first resin layer 14 comprises a cured product of a curable composition that includes an ultraviolet-curable resin composition having a silsesquioxane skeleton. A transparent conductive film 80 has a transparent conductive layer 26 on a surface of the first resin layer 14 of the substrate 10 for forming a transparent conductive layer. In this touch panel, the transparent conductive layer 26 of the transparent conductive film 80 is used as an electrode.
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Inventors:
MATSUMOTO HIRONOBU (JP)
KUROSAWA YOSHIHIRO (JP)
KUROSAWA YOSHIHIRO (JP)
Application Number:
PCT/JP2019/048453
Publication Date:
June 18, 2020
Filing Date:
December 11, 2019
Export Citation:
Assignee:
OTSUKA CHEMICAL CO LTD (JP)
International Classes:
B32B27/00; G06F3/041; H01B5/14
Foreign References:
JP2013123825A | 2013-06-24 | |||
JPH11348189A | 1999-12-21 | |||
JP2005104025A | 2005-04-21 | |||
JP2017155152A | 2017-09-07 | |||
JP2010073495A | 2010-04-02 | |||
JP2011128239A | 2011-06-30 | |||
JP2014131782A | 2014-07-17 | |||
JPH09123333A | 1997-05-13 | |||
JP2009032475A | 2009-02-12 | |||
JP2004269605A | 2004-09-30 | |||
JP2017522581A | 2017-08-10 |
Attorney, Agent or Firm:
WENO & PARTNERS (JP)
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