Title:
SUBSTRATE HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/003148
Kind Code:
A1
Abstract:
An electronic device is provided. The electronic device comprises: a substrate comprising a first conductive line, a second conductive line, a ground plane, and a conductive via hole electrically connecting the first conductive line and the ground plane; at least one electronic component disposed on the substrate; an insulating member covering the at least one electronic component; and a conductive layer. The conductive layer comprises: a first part formed on the surface of the insulating member; a second part extending from the edge of the first part and electrically connected to the first conductive line; and a third part located away from the second part and electrically connected to the second conductive line. The electronic device may comprise at least one transmission line formed from the second conductive line and the third part of the conductive layer.
Inventors:
PARK BONGCHOON (KR)
SUN TAEWON (KR)
KIM SANGYONG (KR)
CHOI BOSUNG (KR)
SUN TAEWON (KR)
KIM SANGYONG (KR)
CHOI BOSUNG (KR)
Application Number:
PCT/KR2022/006965
Publication Date:
January 26, 2023
Filing Date:
May 16, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K9/00; H05K1/02; H05K1/14
Foreign References:
| JP2004071658A | 2004-03-04 | |||
| JP2015035572A | 2015-02-19 | |||
| JP2001217588A | 2001-08-10 | |||
| JPH09307273A | 1997-11-28 | |||
| JP2002334954A | 2002-11-22 |
Attorney, Agent or Firm:
BAE, KIM & LEE IP (KR)
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