Title:
SUBSTRATE HEATING SYSTEM AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/180785
Kind Code:
A1
Abstract:
The present invention prevents damage to a heater by reducing disparity in the thermal expansion of a top plate and the heater and comprises: a top plate 2 on which a substrate W is mounted; a heater 3 that is provided to a lower surface of the top plate 2; a plate temperature detection part 4 that detects the temperature of the top plate 2; a heater temperature detection part 5 that detects the temperature of the heater 3; and a heater control part 6 that controls the output of the heater 3 on the basis of the detected temperature of the heater 3 and the detected temperature of the top plate 2. The heater control part 6 controls the output of the heater 3 such that a detected temperature difference between the detected temperature of the heater 3 and the detected temperature of the top plate 2 does not exceed a prescribed temperature difference upper limit and such that the detected temperature of the top plate 2 is a prescribed set temperature.
Inventors:
IWAKOKE TSUBASA (JP)
YANAI YUMI (JP)
YANAI YUMI (JP)
Application Number:
PCT/JP2018/010821
Publication Date:
September 26, 2019
Filing Date:
March 19, 2018
Export Citation:
Assignee:
NISSIN ELECTRIC CO LTD (JP)
International Classes:
H01L21/02
Foreign References:
| JP2004128278A | 2004-04-22 | |||
| JP2005191265A | 2005-07-14 | |||
| JP2002289601A | 2002-10-04 |
Attorney, Agent or Firm:
NISHIMURA, Ryuhei (JP)
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