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Patent Searching and Data


Title:
SUBSTRATE HOLDER AND PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/003891
Kind Code:
A1
Abstract:
This substrate holder is for holding a substrate and comprises: a first holding member having a first opening part for exposing a first surface of the substrate; and a second holding member for holding the substrate by sandwiching the same with the first holding member, the second holding member having a second opening part for exposing a second surface of the substrate. The first holding member has at least one first external connection contact point, and the second holding member has at least one second external connection contact point that is separate from the first external connection contact point.

Inventors:
MORIYAMA, Shota (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
MIYAMOTO, Matsutaro (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
Application Number:
JP2018/022391
Publication Date:
January 03, 2019
Filing Date:
June 12, 2018
Export Citation:
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Assignee:
EBARA CORPORATION (11-1, Haneda Asahi-cho Ohta-k, Tokyo 10, 〒1448510, JP)
International Classes:
C25D17/08; C25D17/06; C25D21/00
Domestic Patent References:
WO2016190180A12016-12-01
Foreign References:
JP2006233296A2006-09-07
JPS5419649A1979-02-14
JP2015200017A2015-11-12
JP2003301299A2003-10-24
JP2008231539A2008-10-02
JP2008057024A2008-03-13
JP2000150421A2000-05-30
Attorney, Agent or Firm:
ONO, Shinjiro et al. (YUASA AND HARA, Section 206 New Ohtemachi Bldg., 2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 〒1000004, JP)
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