Title:
SUBSTRATE HOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/107553
Kind Code:
A1
Abstract:
The present invention pertains to a substrate holding device which holds a substrate such as a wafer, and particularly, to a substrate holding device used for a polishing device. This substrate holding device (1) comprises: a polishing head (9) which presses a substrate (W) against a polishing surface; a polishing head shaft (11) connected to the polishing head (9); and a power generation device (55) which generates power inside a rotary system (4) including at least the polishing head (9) and the polishing head shaft (11).
Inventors:
NABEYA OSAMU (JP)
Application Number:
PCT/JP2021/039279
Publication Date:
May 27, 2022
Filing Date:
October 25, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/30; B24B49/08; B24B49/10; B24B49/14; H01L21/304
Foreign References:
| JPH10337654A | 1998-12-22 | |||
| JP2018186148A | 2018-11-22 | |||
| JP2017528904A | 2017-09-28 | |||
| US20060258263A1 | 2006-11-16 | |||
| KR20160145305A | 2016-12-20 | |||
| JP2018174230A | 2018-11-08 | |||
| JP2015100911A | 2015-06-04 | |||
| JP2000094312A | 2000-04-04 | |||
| KR20120086077A | 2012-08-02 | |||
| JP2014166678A | 2014-09-11 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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