Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE HOLDING MEMBER AND SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/022258
Kind Code:
A1
Abstract:
A substrate holding member of the present disclosure comprises a body comprising a plate-form ceramic material, and a cover film that covers the surface of the body, wherein when the fracture toughness of the ceramic material is K1C, the thermal expansion coefficient is α1, the thickness is t1, the Young's modulus is E1, the thermal expansion coefficient of the cover film is α2, the thickness is t2, the Young's modulus is E2, the compression strength is σ, and the safety factor of the substrate holding member is Sp, t1 is 0.5 to 30 mm, and t2 is 3 µm or greater, and 0.1 t1 or less, and the F value expressed by formula 1 is 1x1022 or greater. A semiconductor manufacturing device of the present disclosure comprises the abovementioned substrate holding member.

Inventors:
INOUE, Tetsuya (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
YOSHIDA, Masao (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2018/028483
Publication Date:
January 31, 2019
Filing Date:
July 30, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
H01L21/677; B25J15/00; C04B41/83
Foreign References:
JP2004134747A2004-04-30
JP2003285382A2003-10-07
Download PDF: