Title:
SUBSTRATE HOLDING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2007/036996
Kind Code:
A1
Abstract:
[PROBLEMS] Required flatness on the holding surface side is achieved even if
rubber is used as an elastic material. [MEANS FOR SOLVING PROBLEMS] Recessed
air gaps (2) are arranged scattered in a holding surface (1), and the openings
of the air gaps (2) are individually covered by fixation plates (3). At substantially
the center of each fixation plate (3), a surface receiving plate (4) formed of
an elastic material with a size smaller than that of each air gap (2) is installed,
projecting toward a substrate (D) to integrate the fixation plate (3) and the
surface receiving plate (4). Since the surface receiving plates (4) arranged
in a scattered manner are individually made to be in contact with the substrate
to evenly support the substrate (D) surface, if there is a variation in the thickness
of the plates (4) formed of an elastic material, a surface receiving plate (4’)
having an increased thickness is in contact with the substrate (D). As a result,
the surface receiving plate (4’) or the associated fixation plate (3)
is elastically deformed toward the air gap (2) to allow the elastic deformation
to be released into the air gap (2), thereby the plate (4’) with the increased
thickness sags down to the air gap (2) side to be flush with the other surface receiving
plates (4).
Inventors:
YOKOTA MICHIYA (JP)
OHTANI YOSHIKAZU (JP)
OHTANI YOSHIKAZU (JP)
Application Number:
PCT/JP2005/017832
Publication Date:
April 05, 2007
Filing Date:
September 28, 2005
Export Citation:
Assignee:
SHINETSU ENG CO LTD (JP)
YOKOTA MICHIYA (JP)
OHTANI YOSHIKAZU (JP)
YOKOTA MICHIYA (JP)
OHTANI YOSHIKAZU (JP)
International Classes:
G09F9/00; G02F1/1333
Foreign References:
US20030232561A1 | 2003-12-18 | |||
JPH09181156A | 1997-07-11 | |||
JPH05305592A | 1993-11-19 |
Attorney, Agent or Firm:
HOSOI, Sadayuki et al. (14-7 Hakusan 5-chome,, Bunkyo-k, Tokyo01, JP)
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