Title:
SUBSTRATE FOR INSPECTION DEVICE, INSPECTION DEVICE, AND METHOD FOR MANUFACTURING INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/248635
Kind Code:
A1
Abstract:
Provided is a substrate for an inspection device, the substrate having an average thickness of 250 µm to 350 µm and a density of 0.25×106g/m3 to 0.40×106g/m3.
Inventors:
MONJU TAKUYA (JP)
HIRAKAWA MANABU (JP)
HIRAKAWA MANABU (JP)
Application Number:
PCT/JP2023/017509
Publication Date:
December 28, 2023
Filing Date:
May 10, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
G01N37/00; C12Q1/68; G01N35/08
Foreign References:
| JP2021175970A | 2021-11-04 | |||
| JP2015007604A | 2015-01-15 | |||
| JP2021037612A | 2021-03-11 | |||
| US20110111517A1 | 2011-05-12 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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