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Patent Searching and Data


Title:
SUBSTRATE INTEGRATED WITH PASSIVE DEVICE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/222133
Kind Code:
A1
Abstract:
The present disclosure provides a substrate integrated with a passive device and a preparation method therefor, and belongs to the technical field of radio frequencies. The preparation method for the substrate integrated with a passive device in the present disclosure comprises: integrating a passive device on a transparent dielectric layer, the forming of the passive device at least comprising the forming of an inductor, the inductor comprising a first sub-structure formed on a first surface and a second sub-structure formed on a second surface, and a first connection electrode formed in a first connection via to connect the first sub-structure and the second sub-structure in sequence. The forming of the inductor comprises: forming a first metal film layer on a first surface and/or a second surface of the transparent dielectric layer, and forming the first connection electrode in the first connection via by means of an electroplating process, wherein the first connection electrode fills the first connection via; and respectively forming a pattern comprising the first sub-structure on the first surface of the transparent dielectric layer, and forming a pattern comprising the second sub-structure on the second surface of the transparent dielectric layer by means of a patterning process.

Inventors:
CAO ZHANFENG (CN)
YANG JIN (CN)
LIU YINGWEI (CN)
WANG KE (CN)
LI HAIXU (CN)
Application Number:
PCT/CN2021/089230
Publication Date:
October 27, 2022
Filing Date:
April 23, 2021
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01F41/04; H01L23/522
Foreign References:
CN104737246A2015-06-24
CN102136430A2011-07-27
CN111769808A2020-10-13
CN111834341A2020-10-27
CN104517953A2015-04-15
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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