Title:
SUBSTRATE JOINING METHOD, SUBSTRATE JOINING SYSTEM AND METHOD FOR CONTROLLING HYDROPHILIC TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/084285
Kind Code:
A1
Abstract:
Provided is a substrate joining method for joining two substrates, the method comprising: a hydrophilic treatment step for hydrophilizing at least one of the joint surfaces of the two substrates, the joint surfaces being joined to each other; and a joining step for joining the two substrate after the hydrophilic treatment step. The hydrophilic treatment step comprises: a step for carrying out, on the joint surface of the substrate, a N2 RIE treatment of carrying out reactive ion etching using N2 gas; and a step for carrying out an N2 radical treatment of irradiating the joint surface of the substrate with N2 radical after the step for carrying out the N2 RIE treatment.
Inventors:
SUGA TADATOMO (JP)
YAMAUCHI AKIRA (JP)
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2017/039939
Publication Date:
May 11, 2018
Filing Date:
November 06, 2017
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
SUGA TADATOMO (JP)
SUGA TADATOMO (JP)
International Classes:
H01L21/02; B23K20/00; H01L21/3065
Foreign References:
| JP2015211130A | 2015-11-24 | |||
| JP2011249643A | 2011-12-08 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
Download PDF: