Title:
SUBSTRATE FOR LED MOUNTING
Document Type and Number:
WIPO Patent Application WO/2011/065016
Kind Code:
A1
Abstract:
Disclosed is a substrate for LED mounting, which comprises a heat conductive layer (a hest conductive sheet (10)) that is formed from a composition that contains a boron nitride powder and a fluorine resin. The fluorine resin contains a polytetrafluoroethylene. The heat conductive layer has a heat conductivity of not less than 2 W/(m·K). The heat conductive layer has a reflectance of not less than 0.80 at wavelengths of 380 nm, 470 nm and 650 nm.
Inventors:
KITAGAWA DAISUKE (JP)
TAKAYAMA YOSHINARI (JP)
SUEHIRO ICHIRO (JP)
USUI HIDEYUKI (JP)
ODA TAKASHI (JP)
TAKAYAMA YOSHINARI (JP)
SUEHIRO ICHIRO (JP)
USUI HIDEYUKI (JP)
ODA TAKASHI (JP)
Application Number:
PCT/JP2010/006922
Publication Date:
June 03, 2011
Filing Date:
November 26, 2010
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
KITAGAWA DAISUKE (JP)
TAKAYAMA YOSHINARI (JP)
SUEHIRO ICHIRO (JP)
USUI HIDEYUKI (JP)
ODA TAKASHI (JP)
KITAGAWA DAISUKE (JP)
TAKAYAMA YOSHINARI (JP)
SUEHIRO ICHIRO (JP)
USUI HIDEYUKI (JP)
ODA TAKASHI (JP)
International Classes:
H01L33/48
Domestic Patent References:
| WO2006120882A1 | 2006-11-16 |
Foreign References:
| JP2008270709A | 2008-11-06 | |||
| JP2004335853A | 2004-11-25 | |||
| JP2008072895A | 2008-03-27 | |||
| JP2008270709A | 2008-11-06 | |||
| JP2006270002A | 2006-10-05 | |||
| JP2008277817A | 2008-11-13 | |||
| JP2003152295A | 2003-05-23 |
Other References:
See also references of EP 2506320A4
Attorney, Agent or Firm:
KAMADA, KOICHI (JP)
Koichi Kamata (JP)
Koichi Kamata (JP)
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