Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE LIQUID PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/107331
Kind Code:
A1
Abstract:
[Problem] To provide a substrate liquid processing device with which it is possible to highly precisely control the heating of a processing liquid on a substrate in units of zones. [Solution] A substrate liquid processing device is provided with a substrate holding part for holding a substrate, a processing liquid supply part for supplying a processing liquid to a processing surface of the substrate, and a heating unit for heating the processing liquid on the processing surface. The heating unit has a heater, and a first planar body and a second planar body that are provided so as to sandwich the heater. The heater has a plurality of heat generation bodies provided to each of a plurality of heating zones of the heating unit. The first planar body and/or the second planar body has a groove, the groove being provided in a region that corresponds to a boundary between adjacent heating zones from among the plurality of heating zones.

Inventors:
MOTOMATSU KAZUKI (JP)
KANEKO SATOSHI (JP)
Application Number:
PCT/JP2018/043496
Publication Date:
June 06, 2019
Filing Date:
November 27, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C18/31; H01L21/304
Foreign References:
JP2017082290A2017-05-18
JP2002129344A2002-05-09
JPH10249891A1998-09-22
JPS6128617U1986-02-20
JP2005060792A2005-03-10
JP2018003097A2018-01-11
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
Download PDF: