Title:
SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/085165
Kind Code:
A1
Abstract:
This substrate liquid processing method includes: a step for holding a substrate (W) using a substrate-holding part (52); a step for supplying a plating liquid (L1) to the upper surface of the substrate; a step for covering the substrate with a lid body (6) having a ceiling part (61) positioned above the held substrate; and a step for heating the plating liquid on the substrate, in a state in which the substrate is covered by the lid body, by using a heating unit (63) provided to the lid body and/or the substrate-holding part. In the step for heating the plating liquid, the lid body and/or the substrate-holding part is actuated vertically to perform a gas discharge action for pushing out a reaction gas remaining between the lid body and the substrate.
Inventors:
INATOMI YUICHIRO (JP)
Application Number:
PCT/JP2020/039018
Publication Date:
May 06, 2021
Filing Date:
October 16, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C18/31
Foreign References:
| JP2018003097A | 2018-01-11 | |||
| JP2004107747A | 2004-04-08 | |||
| JP2005002448A | 2005-01-06 | |||
| JP2003129250A | 2003-05-08 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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