Title:
SUBSTRATE LIQUID TREATMENT DEVICE AND SUBSTRATE LIQUID TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2022/270351
Kind Code:
A1
Abstract:
A substrate liquid treatment device comprising: a substrate holding unit for holding a substrate; a rotational drive unit for rotating the substrate being held by the substrate holding unit; a liquid ejection unit including a liquid supply nozzle for ejecting a liquid toward a treatment surface of the substrate; a treatment fluid ejection unit including a treatment fluid supply nozzle for ejecting a mist of treatment fluid toward the treatment surface; a first drive unit for moving the treatment fluid supply nozzle; and a control unit for controlling the treatment fluid ejection unit, the first drive unit, and the liquid ejection unit. The control unit controls the liquid ejection unit to cause the liquid to be ejected from the liquid supply nozzle toward the treatment surface of the substrate being rotated, and also controls the treatment fluid ejection unit and the first drive unit so that the landing position of the treatment fluid from the treatment fluid supply nozzle on the treatment surface with a liquid film including the liquid formed thereon is moved from the outer periphery of the treatment surface toward the center thereof.
Inventors:
OBARU TAKANORI (JP)
Application Number:
PCT/JP2022/023762
Publication Date:
December 29, 2022
Filing Date:
June 14, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2006086415A | 2006-03-30 | |||
| JP2021057503A | 2021-04-08 | |||
| JP2014179566A | 2014-09-25 | |||
| JP2003203892A | 2003-07-18 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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