SUBSTRATE MACHINING METHOD, SUBSTRATE MACHINING DEVICE, SUBSTRATE CARRYING METHOD, AND SUBSTRATE CARRYING MECHANISM

WIPO Patent Application WO/2005/053925

A1

A substrate machining device for dicing a motor substrate into unit substrates, comprising a scribe part forming scribe lines on the motor substrate, a break part breaking the mother substrate along the formed scribe lines, and a substrate carrying part carrying the mother substrate or the unit substrates between at least the scribe part and the break part. The substrate carrying part further comprises a plurality of rotating pedestals (51) having sucking faces sucking and holding the substrate on the principal plane of the substrate. Each of the rotating pedestals (51) further comprises a substrate sucking and rotating means having a rotating shaft (52) and approximately simultaneously rotating the substrate around the rotating shaft (52) so that at least both principal planes of the substrate are vertically reversed in the state that the substrate is sucked and held. As a result, the substrate can be prevented from being damaged in carrying the substrate including the reversal of the substrate. Also, the size of the substrate machining device having the substrate carrying mechanism can be reduced to reduce the installation area for the device.

OKAJIMA YASUTOMO (JP)
NAKATA KATSUYOSHI (JP)

PCT/JP2004/018048

June 16, 2005

December 03, 2004

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MITSUBOSHI DIAMOND IND CO LTD (JP)
OKAJIMA YASUTOMO (JP)
NAKATA KATSUYOSHI (JP)

B28D5/00; B65G49/06; B65H15/00; C03B33/027; C03B33/03; C03B33/033; (IPC1-7): B28D5/00; B65H15/00; C03B33/03

JPH11116260A	1999-04-27
JPH0625246U	1994-04-05

Kashima, Yoshio (7-2 Minami Ogi-machi, Kita-ku, Osaka-cit, Osaka 52, JP)

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