Title:
SUBSTRATE MANUFACTURING METHOD, SUBSTRATE, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/186738
Kind Code:
A1
Abstract:
A substrate manufacturing method comprising: a first resin layer formation step (S1) for forming a first resin layer on a substrate; a first resin layer firing step (S2) for firing the first resin layer and forming a first fired resin layer; a first defect determination step (S3) for determining a first defect in the first fired resin layer; a first through-hole formation step (S4) for forming a first through-hole that reaches the position at which the first defect exists, from the surface of the first fired resin layer to the first defect; a first polishing step (S5), after the first through hole formation step (S4), for polishing the area around the position at which the first defect exists in the first fired resin layer; and a first inorganic film formation step (S6) for forming a first inorganic film on the first fired resin layer.
Inventors:
FUJITA TETSUO
NAKATA YUKINOBU
SUGIMOTO HIROSHI
SAKURAI TAKEHISA
FUJIWARA MASAKI
YOSHIDA TOKUO
OKAZAKI SHOJI
TANAKA TETSUNORI
NAKATA YUKINOBU
SUGIMOTO HIROSHI
SAKURAI TAKEHISA
FUJIWARA MASAKI
YOSHIDA TOKUO
OKAZAKI SHOJI
TANAKA TETSUNORI
Application Number:
PCT/JP2018/012594
Publication Date:
October 03, 2019
Filing Date:
March 27, 2018
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H05B33/02; G09F9/30; H01L27/32; H01L51/50; H05K3/12
Foreign References:
| JP2017105036A | 2017-06-15 | |||
| JP2003209330A | 2003-07-25 | |||
| CN107463042A | 2017-12-12 | |||
| CN107402468A | 2017-11-28 |
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
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