SUBSTRATE MANUFACTURING METHOD AND EXPOSURE APPARATUS

WIPO Patent Application WO/2007/001023

A1

An exposure position is accurately controlled in exposure treatment for forming a structural member on a substrate. The substrate is arranged on a stage (22) of an exposure apparatus (31), photographing is performed by arranging a low magnification camera (27) above a corner of the substrate, based on a temporary coordinate system defined on the stage (22), and a mark arranged for alignment is identified. Then, based on the position where the mark is identified, an actual coordinate system is defined to match the actual arrangement status of the substrate, based on the position where the mark is identified. Coordinates of a prescribed reference point in the actual coordinate system are calculated, photographing is performed by arranging the high magnification camera (28) at a position indicated by the coordinates, and a pattern of the structural member formed on the substrate in the previous step is identified. The actual position of the reference point is specified from the identified pattern, and in accordance with the shape of an area specified by the actual reference point, an image to be recorded by exposure in the area is corrected and then exposure recording of the image is performed.

OZAKI TAKAO (JP)
EJIRI TEPPEI (JP)

PCT/JP2006/312892

January 04, 2007

June 28, 2006

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FUJIFILM CORP (JP)
OZAKI TAKAO (JP)
EJIRI TEPPEI (JP)

G03F7/20; G03F9/00

JP2004327660A	2004-11-18
JP2006058496A	2006-03-02
JP2004163814A	2004-06-10
JP2004012903A	2004-01-15
JP2005026287A	2005-01-27
JP2004111473A	2004-04-08
JP2004272168A	2004-09-30
JP2004311963A	2004-11-04
JP2003122030A	2003-04-25

YANAGIDA, Masashi et al. (7F Shin-Yokohama KS Bldg., 3-18-3, Shin-Yokohama, Kohoku-k, Yokohama-shi Kanagawa, JP)

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