Title:
SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/186565
Kind Code:
A1
Abstract:
A substrate manufacturing method and a substrate. According to the substrate manufacturing method, by means of etching a black matrix (30) and an electrode layer (40) located in a dummy area (12), at least one groove (41) penetrating through the black matrix (30) and the electrode layer (40) is formed; and subsequently, when an alignment film solution is applied to the electrode layer (40) and a base substrate (10), since the terrain of a film layer structure located in the dummy area (12) is similar to the terrain of a film layer structure in an active area (11), it can be guaranteed that the thickness of an alignment film (50) located in the active area (11) tends to be the same as the thickness of the alignment film (50) in the dummy area (12), thereby improving the film thickness uniformity of alignment films (50). According to the substrate (10), the thickness of the alignment film (50) located in the active area (11) tends to be the same as the thickness of the alignment film (50) in the dummy area (12); therefore, the film thickness uniformity of alignment films (50) is good.
Inventors:
REN WEI (CN)
Application Number:
PCT/CN2019/081574
Publication Date:
September 24, 2020
Filing Date:
April 04, 2019
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
G02F1/1337; G02F1/1335
Foreign References:
| CN103033992A | 2013-04-10 | |||
| CN102799029A | 2012-11-28 | |||
| CN106773340A | 2017-05-31 | |||
| US20070279565A1 | 2007-12-06 | |||
| CN105549269A | 2016-05-04 |
Attorney, Agent or Firm:
COMIPS INTELLECTUAL PROPERTY OFFICE (CN)
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