Title:
SUBSTRATE MATERIAL CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/242129
Kind Code:
A1
Abstract:
A substrate material cutting device, comprising: a mounting frame (1); a base (2) mounted on the mounting frame (1); an upper cutter means (3) disposed on the mounting frame (1); and a substrate material clamp (6) disposed on the upper cutter means (3) and used for clamping a substrate material, the substrate material clamp (6) comprising a clamp body (6-2) and an unbending component (6-1) connected to the clamp body (6-2), and the unbending component (6-1) being used for unbending the substrate material. By means of the provision of the unbending component (6-1) on the lower surface of the substrate material clamp (6), when the substrate material clamp (6) is approaching the base (2), the unbending component (6-1) unbends the bent substrate material, so as to improve the quality of the substrate material.
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Inventors:
JIAN DONGWEI (CN)
WANG ZHENNAN (CN)
LEI SHAOWEN (CN)
YANG YONGLEI (CN)
ZHANG WEI (CN)
WU YING (CN)
LIU YANG (CN)
WANG ZHENNAN (CN)
LEI SHAOWEN (CN)
YANG YONGLEI (CN)
ZHANG WEI (CN)
WU YING (CN)
LIU YANG (CN)
Application Number:
PCT/CN2018/106141
Publication Date:
December 26, 2019
Filing Date:
September 18, 2018
Export Citation:
Assignee:
LINGFAN RENEWABLE ENERGY TECH BEIJING CO LTD (CN)
International Classes:
B23D33/02; B23D15/04
Foreign References:
| CN203156144U | 2013-08-28 | |||
| CN206662375U | 2017-11-24 | |||
| CN205289915U | 2016-06-08 | |||
| KR20160110826A | 2016-09-22 |
Other References:
None
Attorney, Agent or Firm:
BEIJING ZHICHEN INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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