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Title:
SUBSTRATE MATERIAL PIECE, FLEXIBLE CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE FLEXIBLE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2001/056340
Kind Code:
A1
Abstract:
A substrate material piece (2), comprising a non-thermoplastic resin film (11), a thermoplastic resin film (10) formed on the non-thermoplastic resin film (11), and metallic wiring (8) formed on the surface of the thermoplastic resin film (10), wherein at least a part of the metallic wiring (8) is exposed on the upper surface of the substrate material piece (2) and a connection part (12) is formed at that part and, a metallic film with low melting point (13) is formed on the connection part (12), connection parts (12a, 12b) of two substrate material pieces (2a, 2b) are brought into contact with each other and pressed while being heated so as to soften the thermoplastic resin films (10a, 10b), stick the substrate material pieces (2a, 2b) to each other, and fuse and solidify metallic films (13a, 13b) with low melting point in order to connect the connection parts (12a, 12b) to each other; a part not used for the connection of the metallic wiring (8) being a wiring part (17) connecting the connection parts (12) to each other, a cover film (19) being able to be arranged on its surface, and a distance between the connection parts (12a, 12b) being able to be connected by the application of ultrasonic wave.

Inventors:
KURITA HIDEYUKI (JP)
WATANABE MASANAO (JP)
SINOHARA TOSHIHIRO (JP)
FUKUDA MITSUHIRO (JP)
ANZAI YUKIO (JP)
Application Number:
PCT/JP2000/000443
Publication Date:
August 02, 2001
Filing Date:
January 28, 2000
Export Citation:
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Assignee:
SONY CHEMICALS CORP (JP)
KURITA HIDEYUKI (JP)
WATANABE MASANAO (JP)
SINOHARA TOSHIHIRO (JP)
FUKUDA MITSUHIRO (JP)
ANZAI YUKIO (JP)
International Classes:
H05K1/03; H05K3/36; H05K1/00; H05K3/28; H05K3/30; H05K3/34; (IPC1-7): H05K1/14; H05K1/02; H05K3/24; H05K3/36
Foreign References:
JPH07312468A1995-11-28
JPH0236071U1990-03-08
JPS4537847B1
JPH08213729A1996-08-20
JPH0794861A1995-04-07
JPH07212036A1995-08-11
JPS6370595A1988-03-30
JP2000049423A2000-02-18
JP2000068624A2000-03-03
JP2000101210A2000-04-07
Attorney, Agent or Firm:
Ishijima, Shigeo (Toranomon 1-chome Minato-ku Tokyo, JP)
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