Title:
SUBSTRATE, METAL FILM, METHOD FOR PRODUCING SUBSTRATE, AND METHOD FOR PRODUCING METAL FILM
Document Type and Number:
WIPO Patent Application WO/2013/001801
Kind Code:
A1
Abstract:
A substrate (100) comprises: a conductive body layer which has a surface layer comprising a Fe-Ni-based metallic material; a surface coating film (12) which is formed on at least a portion of the surface of the conductive body layer; and a resin layer (20) which is so provided as to be in contact with the surface coating film (12). The surface coating film (12) comprises: a tin film which is adhered onto at least a portion of the surface of the conductive body layer; and an organic silane compound which decorates the surface of the tin film. By employing this constitution, it becomes possible to improve the adhesion between the conductive body layer comprising an Fe-Ni-based metallic material and the resin layer.
Inventors:
ITO TEPPEI (JP)
Application Number:
PCT/JP2012/004146
Publication Date:
January 03, 2013
Filing Date:
June 27, 2012
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
ITO TEPPEI (JP)
ITO TEPPEI (JP)
International Classes:
H05K1/09; H05K1/03; H05K3/24
Domestic Patent References:
| WO2010058443A1 | 2010-05-27 |
Foreign References:
| JPH07106770A | 1995-04-21 | |||
| JP2002285354A | 2002-10-03 | |||
| JP2002206191A | 2002-07-26 | |||
| JP2002275643A | 2002-09-25 | |||
| JP2002176259A | 2002-06-21 | |||
| JP2004311849A | 2004-11-04 | |||
| JPH01286339A | 1989-11-17 | |||
| JP2002111174A | 2002-04-12 | |||
| JP2005333078A | 2005-12-02 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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Claims: