SUBSTRATE AND METAL LAYER MANUFACTURING METHOD

Title:

SUBSTRATE AND METAL LAYER MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2014/069306

Kind Code:

A1

Abstract:

This substrate is provided with an insulating substrate having a first surface and a second surface, and a metal layer comprising a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer comprises: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned in the vicinity of the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides to each other, and is bent with respect to the outer periphery sections at the first end and the second end. The outer periphery sections are divided into a first outer periphery section that is contiguous with the first end of the bent section, and a second outer periphery section that is contiguous with the second end of the bent section.

Inventors:

OZAKI KIMINORI (JP)
KOIKE YASUHIRO (JP)
ASANO HOROAKI (JP)
SHIMADU HITOSHI (JP)
KAWAGUCHI SHIGEKI (JP)
ASAI TOMOAKI (JP)

Application Number:

PCT/JP2013/078712

Publication Date:

May 08, 2014

Filing Date:

October 23, 2013

Export Citation:

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Assignee:

TOYOTA JIDOSHOKKI KK (JP)

International Classes:

H05K1/02

Domestic Patent References:

WO2011013673A1

2011-02-03

Foreign References:

JP2000307202A	2000-11-02
JP2000031606A	2000-01-28
JPH08186339A	1996-07-16
JPH06275940A	1994-09-30
JPH03117862U	1991-12-05

Other References: