Title:
SUBSTRATE, METHOD FOR FORMING PACKAGE STRUCTURE BY USING SUBSTRATE, AND PACKAGE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/134268
Kind Code:
A1
Abstract:
Provided is a substrate (1), comprising: a substrate body (11), a first recess structure (12), and a second recess structure (13). The substrate body has a bonding surface that bonds a bonded component (3) by means of a bonding material (2). The first recess structure is formed in the bonding surface, and comprises an opening having a size equal to the size of the bonded component so that the bonded component can be oriented in a plane direction of the bonding surface. The second recess structure is formed in the first recess structure and has a second depth such that the first recess structure has a first depth less than the second depth only at a plurality of support positions along the perimeter, wherein the bonded component can be supported in a vertical direction at the support positions.
Inventors:
DUAN YINXIANG (CN)
ZHOU MENG (CN)
XU HU (CN)
TIAN ZIFENG (CN)
ZHANG SHIZHONG (CN)
XU YANZHENG (CN)
ZHOU MENG (CN)
XU HU (CN)
TIAN ZIFENG (CN)
ZHANG SHIZHONG (CN)
XU YANZHENG (CN)
Application Number:
PCT/CN2018/080876
Publication Date:
July 11, 2019
Filing Date:
March 28, 2018
Export Citation:
Assignee:
YLX INC (CN)
International Classes:
H01L23/12; H01L21/52; H01L33/50
Foreign References:
| CN105684170A | 2016-06-15 | |||
| CN105814681A | 2016-07-27 | |||
| CN104517931A | 2015-04-15 |
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