SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE

WIPO Patent Application WO/2022/209851

A1

The present invention provides a substrate which can be easily conveyed despite being thin, and a method for producing a wiring substrate that uses this substrate. In a substrate (10), a first metal layer (12), a first insulating resin layer (13), a second metal layer (14), a second insulating resin layer (15), and a carrier-equipped ultrathin metal foil layer (11) are laminated in this order. The substrate (10) has, in the planar direction, a circuit formation region (10A) and an outer peripheral region (10B) which is provided at the outer periphery of the circuit formation region (10A). In the circuit formation region (10A), the carrier (11B) of the carrier-equipped ultrathin metal foil layer (11) is removed such that the ultrathin metal foil layer (11A) is exposed, and thickness is not more than 80 μm. Provided in at least part of the outer peripheral region (10B), is a carrier remaining part (10C) in which the carrier (11B) remains and the surface of the ultrathin metal foil layer (11A) is covered by the carrier (11B).

HIRANO SHUNSUKE (JP)
MUTO TOMOHIRO (JP)
NOBUKUNI TAKESHI (JP)
NAKAJIMA YOUICHI (JP)
SATAKE MIKA (JP)
KITAMURA SHINYA (JP)

PCT/JP2022/011600

October 06, 2022

March 15, 2022

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MGC ELECTROTECHNO CO LTD (JP)
YONEZAWA DIA ELECTRONICS CO INC (JP)

B32B15/08; H05K3/00

WO2020121652A1

2020-06-18

KR100751994B1

2007-08-28

FUJIKI Hiroshi et al. (JP)

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