Title:
SUBSTRATE, MICROCHIP, SUBSTRATE MANUFACTURING METHOD, AND MICROCHIP MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/077119
Kind Code:
A1
Abstract:
Provided are: a substrate (10) having two or more kinds of surface states having different characteristics; a microchip (100); and methods for manufacturing the substrate and the microchip. Specifically, metal patterns or metal oxide patterns (1a, 1b) are formed on the substrate (10), and surface treatment films (2a, 2b) are formed on the metal patterns or the metal oxide patterns (1a, 1b), thereby providing the substrate (10) having two or more kinds of surface states having different characteristics, and the microchip (100).
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Inventors:
TAKAHASHI KATSUYOSHI
KITAGAWA TOSHIAKI
KITAGAWA TOSHIAKI
Application Number:
PCT/JP2012/076951
Publication Date:
May 30, 2013
Filing Date:
October 18, 2012
Export Citation:
Assignee:
SHARP KK (JP)
TAKAHASHI KATSUYOSHI
KITAGAWA TOSHIAKI
TAKAHASHI KATSUYOSHI
KITAGAWA TOSHIAKI
International Classes:
G01N35/08; B01J19/00; G01N37/00
Foreign References:
JP2008132410A | 2008-06-12 | |||
JP4385166B2 | 2009-12-16 | |||
JP2010061001A | 2010-03-18 | |||
JP2011169695A | 2011-09-01 |
Other References:
L. RIZZELLO ET AL.: "Microscale Patterning of Hydrophobic/Hydrophilic Surfaces by Spatially Controlled Galvanic Displacement Reactions", LANGMUIR, vol. 25, no. 11, 24 April 2009 (2009-04-24), pages 6019 - 6023
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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Claims: