Title:
SUBSTRATE MODULE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/040081
Kind Code:
A1
Abstract:
A first ACF (150a) having high connection reliability but weak surface tackiness and a second ACF (150b) having high parts-mounting capability due to having strong surface tackiness are pasted onto a bulging section (111) of a glass substrate (110) that comprises a liquid crystal module (100). Since an LSI (130) and electronic parts (150) will be mounted onto the glass substrate (110) with these ACFs disposed therebetween, high-speed mounting of electronic parts is made possible, while connection reliability is secured.
Inventors:
NAGAOKA GEN
HIDA YASUHIRO
MIYAZAKI HIROKI
HIDA YASUHIRO
MIYAZAKI HIROKI
Application Number:
PCT/JP2010/058016
Publication Date:
April 07, 2011
Filing Date:
May 12, 2010
Export Citation:
Assignee:
SHARP KK (JP)
NAGAOKA GEN
HIDA YASUHIRO
MIYAZAKI HIROKI
NAGAOKA GEN
HIDA YASUHIRO
MIYAZAKI HIROKI
International Classes:
H01L21/60; G02F1/1345; G09F9/00
Foreign References:
| JP2006235295A | 2006-09-07 | |||
| JP2005268590A | 2005-09-29 | |||
| JP2000286298A | 2000-10-13 | |||
| JP2004006793A | 2004-01-08 | |||
| JP2006235295A | 2006-09-07 |
Attorney, Agent or Firm:
SHIMADA, AKIHIRO (JP)
Akihiro Shimada (JP)
Akihiro Shimada (JP)
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