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Patent Searching and Data


Title:
SUBSTRATE MODULE FOR MEASURING VIBRATION AND VIBRATION DETECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/191948
Kind Code:
A1
Abstract:
Provided is a vibration sensor 1 which, as a substrate module for measuring vibration, comprises: a substrate 10 having a first surface 10b and a second surface 10a that oppose each other, a pair of support-side edges 10c that oppose each other, a pair of non-contact side edges 10d that intersect with the support-side edges, and a pair of fixed ends 11 that are provided on or near the pair of support-side edges; a protrusion-shaped member 18 sandwiched by the pair of fixed ends and provided in the center or near the center of the first surface of the substrate; a conductive pattern 12 provided on the second surface; and a piezoelectric element 13 provided inside a second region 102 on the second surface that corresponds to a first region 101 where the protrusion-shaped member is affixed. 

Inventors:
MATSUDA ISAO (JP)
HORIUCHI HIROKI (JP)
OSHITA JUNJI (JP)
MOTEGI TAKAYUKI (JP)
Application Number:
PCT/JP2020/012632
Publication Date:
September 30, 2021
Filing Date:
March 23, 2020
Export Citation:
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Assignee:
TAIYO YUDEN KK (JP)
International Classes:
G01H1/00; A61B5/02
Domestic Patent References:
WO2017187710A12017-11-02
Foreign References:
CN203953630U2014-11-26
JPS6055928A1985-04-01
JP2019152480A2019-09-12
JP2002078688A2002-03-19
JPH08103419A1996-04-23
JP2004303506A2004-10-28
JP2005319171A2005-11-17
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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