Title:
SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/097745
Kind Code:
A1
Abstract:
This substrate has: an insulator layer 10 having a plurality of recessed sections; and a metal layer 120 provided on the insulator layer 10. A portion or all of the plurality of recessed sections 11 have the largest lateral cross-sectional area inside the insulator layer 10, or a portion or all of the plurality of recessed sections 11 have inclined sections 135 inclined in the thickness direction in the longitudinal cross-section. A portion of the metal layer 120 is provided inside the plurality of recessed sections 11.
Inventors:
SASAKI BEJI (JP)
Application Number:
PCT/JP2018/017501
Publication Date:
May 23, 2019
Filing Date:
May 02, 2018
Export Citation:
Assignee:
FREESIA MACROSS CORP (JP)
International Classes:
H05K3/38; H01L23/12; H05K3/46
Foreign References:
| JPH07188935A | 1995-07-25 | |||
| JPH07193373A | 1995-07-28 | |||
| JPS60167493A | 1985-08-30 |
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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