Title:
SUBSTRATE FOR MOUNTING LED, AND LED-MOUNTED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/008422
Kind Code:
A1
Abstract:
[Problem] To provide a substrate which is for mounting an LED, the substrate being applicable to a thin substrate, being able to obtain sufficient reflectance, and being specifically suited for a mini-LED or μ-LED. [Solution] This substrate for mounting an LED comprises a substrate and a reflective layer laminated on an upper region of the substrate, wherein: a plurality of openings are provided in the reflective layer at substantially equal intervals in the longitudinal and lateral directions; the reflective layer is a cured product of a curable resin composition containing a curable resin and a titanium oxide; the storage modulus of the cured product at 25 °C is 4.0 GPa or less; the longitudinal or lateral interval between an opening and an adjacent opening is at least two times the longitudinal or lateral length of the opening; and the ratio of the total area of the openings to the area of the reflective layer is 0.1-9.0%.
Inventors:
KOH MEITEN (JP)
ONODA HARUKA (JP)
SHIMURA MASAYUKI (JP)
NAKAJIMA KOSUKE (JP)
ONODA HARUKA (JP)
SHIMURA MASAYUKI (JP)
NAKAJIMA KOSUKE (JP)
Application Number:
PCT/JP2022/028766
Publication Date:
February 02, 2023
Filing Date:
July 26, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
H05K3/28; H01L33/60
Domestic Patent References:
WO2019240186A1 | 2019-12-19 | |||
WO2019131636A1 | 2019-07-04 |
Foreign References:
JP2019185921A | 2019-10-24 | |||
JP2019016629A | 2019-01-31 | |||
JP2018207048A | 2018-12-27 | |||
JP2016127127A | 2016-07-11 | |||
JP2020109718A | 2020-07-16 | |||
US20140204578A1 | 2014-07-24 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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