Title:
SUBSTRATE FOR MOUNTING LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE
Document Type and Number:
WIPO Patent Application WO/2017/033890
Kind Code:
A1
Abstract:
This substrate for mounting a light emitting element comprises: a substrate; a mounting part in a main surface of the substrate, on which a light emitting element is mounted; and a resin frame which is provided so as to surround the mounting part when viewed in plan, and which is in contact with a sealing material for sealing the mounted light emitting element. A main surface of the resin frame is provided with a recess such that the recess surrounds the mounting part when viewed in plan.
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Inventors:
KAWAGOE HIROSHI (JP)
YOSHIDA MASATAKA (JP)
YOSHIDA MASATAKA (JP)
Application Number:
PCT/JP2016/074386
Publication Date:
March 02, 2017
Filing Date:
August 22, 2016
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L33/54; F21S2/00; F21V31/00; H01L23/12; H01L23/29; H01L23/31; H01L33/00; F21Y115/10
Foreign References:
| JP2013171969A | 2013-09-02 | |||
| JP2011233645A | 2011-11-17 | |||
| JP2013030572A | 2013-02-07 | |||
| JP2012015176A | 2012-01-19 |
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