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Patent Searching and Data


Title:
SUBSTRATE, OLED ENCAPSULATION STRUCTURE, AND MANUFACTURING METHOD OF OLED ENCAPSULATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/129965
Kind Code:
A1
Abstract:
A substrate, an OLED encapsulation structure and a method for manufacturing the OLED encapsulation structure are provided. The substrate (10) includes a display area (11), an encapsulation area (12) surrounding the display area (11) and a metal loop wire (30). The OLED encapsulation structure includes: a substrate (10) defining a display area (11) and an encapsulation area (12) surrounding the display area (11); an OLED device layer provided in the display area (11); a metal loop wire (30) provided in the encapsulation area (12) and having no electrical function; an inorganic encapsulation material layer (40) provided in the encapsulation area (12) and covering the metal loop wire (30); and a cover plate (50) connected with the substrate (10) through the inorganic encapsulation material layer (40) in a sealed manner. By separately providing the metal loop wire, it is possible to accelerate temperature rise of the inorganic encapsulation material greatly, thereby rapidly melting and sintering it together, and protect ESD effectively, thereby extending service life of the OLED.

Inventors:
JIN YONG (CN)
Application Number:
PCT/CN2017/105903
Publication Date:
July 19, 2018
Filing Date:
October 12, 2017
Export Citation:
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Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H01L51/56; H01L51/52
Domestic Patent References:
WO2016124640A12016-08-11
Foreign References:
CN107046104A2017-08-15
CN102983279A2013-03-20
CN104201295A2014-12-10
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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