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Title:
SUBSTRATE PLACEMENT TABLE FOR HEATING SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR SUBSTRATE HEATING HEATER
Document Type and Number:
WIPO Patent Application WO/2018/230408
Kind Code:
A1
Abstract:
This ceramic substrate placement table for semiconductor substrate heating has one surface that serves as a placement surface for semiconductor substrates, and has, on the surface opposite the placement surface, a connection part for a cylindrical support body , the substrate placement table being provided with a plurality of heat generating circuits provided inside the substrate placement table, and a plurality of electrode terminals provided inside a region to which the cylindrical support body is connected. One end of each of at least two heat generating circuits among the heat generating circuits is connected to a common electrode terminal that is one electrode terminal among the electrode terminals via a common extended portion.

Inventors:
SHINMA KENJI (JP)
NISHIMOTO YOSHIHIRO (JP)
SAKITA SHIGENOBU (JP)
MIKUMO AKIRA (JP)
Application Number:
PCT/JP2018/021661
Publication Date:
December 20, 2018
Filing Date:
June 06, 2018
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01L21/683; H05B3/03; H05B3/20; H05B3/68
Foreign References:
JP2010177595A2010-08-12
JP2005032933A2005-02-03
JP2011210931A2011-10-20
JP2013161522A2013-08-19
JPH08125001A1996-05-17
JP2004296254A2004-10-21
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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