Title:
SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/216445
Kind Code:
A1
Abstract:
The present invention planarizes a substrate that has recesses and projections. The present invention provides a method for chemically mechanically polishing a substrate; and this method comprises a step for polishing a substrate with use of a processing liquid and a step for changing the concentration of an active ingredient of the processing liquid, said active ingredient contributing to the polishing of the substrate.
Inventors:
FUKUNAGA AKIRA (JP)
WATANABE KATSUHIDE (JP)
KOBATA ITSUKI (JP)
TSUJIMURA MANABU (JP)
WATANABE KATSUHIDE (JP)
KOBATA ITSUKI (JP)
TSUJIMURA MANABU (JP)
Application Number:
PCT/JP2018/017517
Publication Date:
November 29, 2018
Filing Date:
May 02, 2018
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B37/00
Foreign References:
| JP2008277601A | 2008-11-13 | |||
| JPH09298176A | 1997-11-18 | |||
| JP2001144058A | 2001-05-25 | |||
| JP2004351575A | 2004-12-16 | |||
| JP2004048033A | 2004-02-12 | |||
| JP2013219133A | 2013-10-24 | |||
| JP2004172338A | 2004-06-17 | |||
| JP2002093761A | 2002-03-29 | |||
| JP2009267367A | 2009-11-12 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
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