Title:
SUBSTRATE POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/133124
Kind Code:
A1
Abstract:
A substrate polishing apparatus, comprising an object platform (10), a lifting platform (20), and a polishing head (30). The lifting platform (20) is located above the object platform (10) and can move upward or downward with respect to the object platform (10) along a direction perpendicular to an upper surface of the object platform (10); the polishing head (30) is mounted on the lifting platform (20) and can polish a polishing area of a to-be-polished substrate placed on the object platform (10); the polishing area is a partially scratched area of the to-be-polished substrate.
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Inventors:
HU WEIQIN (CN)
CHEN CHANGXU (CN)
CHEN CHANGXU (CN)
Application Number:
PCT/CN2016/082023
Publication Date:
August 10, 2017
Filing Date:
May 13, 2016
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE DISPLAY TECH CO (CN)
BEIJING BOE DISPLAY TECH CO (CN)
International Classes:
B24B37/10
Foreign References:
CN104647193A | 2015-05-27 | |||
CN103128628A | 2013-06-05 | |||
CN105033839A | 2015-11-11 | |||
US20030100196A1 | 2003-05-29 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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