Title:
SUBSTRATE POLISHING DEVICE, SUBSTRATE POLISHING METHOD, POLISHING DEVICE, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/176611
Kind Code:
A1
Abstract:
This substrate polishing device performs a polishing process on a processing surface of a substrate and comprises a grinding module in which a first grinding member and a second grinding member that has a larger maximum diameter than the first grinding member are disposed, a polishing module including a polishing member, and a control device that controls the grinding module and the polishing module. The control device controls the grinding module so as to perform first grinding on a part of the processing surface by the first grinding member and second grinding on the processing surface by the second grinding member, and controls the polishing module so as to polish the processing surface that has been subjected to the first grinding and the second grinding.
Inventors:
YOSHIDA ATSUSHI (JP)
ISHII YU (JP)
NAKANISHI MASAYUKI (JP)
ISHII YU (JP)
NAKANISHI MASAYUKI (JP)
Application Number:
PCT/JP2023/008724
Publication Date:
September 21, 2023
Filing Date:
March 08, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/005; B24B7/00; B24B21/00; B24B37/013; B24B37/10; B24B37/32; B24B41/06; B24B49/10; B24B49/12; H01L21/304
Domestic Patent References:
| WO2019151041A1 | 2019-08-08 |
Foreign References:
| JP2003334757A | 2003-11-25 | |||
| JP2021154421A | 2021-10-07 | |||
| JP2021170659A | 2021-10-28 | |||
| JP2020205443A | 2020-12-24 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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