Title:
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULES, AND PASTE FOR BONDING COPPER MEMBER
Document Type and Number:
WIPO Patent Application WO/2013/115359
Kind Code:
A1
Abstract:
This substrate for power modules is obtained by laminating and bonding a copper plate, which is formed of copper or a copper alloy, onto the surface of a ceramic substrate (11). A nitride layer (31) is formed on the surface of the ceramic substrate (11) between the copper plate and the ceramic substrate (11). An Ag-Cu eutectic structure layer (32) having a thickness of 15 μm or less is formed between the nitride layer and the copper plate.
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Inventors:
TERASAKI NOBUYUKI (JP)
NAGATOMO YOSHIYUKI (JP)
NISHIKAWA KIMIHITO (JP)
KUROMITSU YOSHIROU (JP)
NAGATOMO YOSHIYUKI (JP)
NISHIKAWA KIMIHITO (JP)
KUROMITSU YOSHIROU (JP)
Application Number:
PCT/JP2013/052347
Publication Date:
August 08, 2013
Filing Date:
February 01, 2013
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/13; B23K35/30; B23K35/32; C22C5/06; C22C14/00; C22C16/00; C22C27/02; C22C28/00; H01L23/36
Foreign References:
| JPH0936540A | 1997-02-07 | |||
| JP2000031609A | 2000-01-28 | |||
| JPH05156303A | 1993-06-22 | |||
| JP3171234B2 | 2001-05-28 | |||
| JPS60177634A | 1985-09-11 | |||
| JP3211856B2 | 2001-09-25 |
Other References:
See also references of EP 2811513A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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Claims: