Title:
SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2014/157112
Kind Code:
A1
Abstract:
The present invention is a substrate (10) for power modules, which is provided with an insulating substrate (11), a circuit layer (12) that is formed on one surface of the insulating substrate (11), and a metal layer (13) that is formed on the other surface of the insulating substrate (11). The circuit layer (12) has a first aluminum layer (12A) that is formed of aluminum or an aluminum alloy and is bonded to the insulating substrate (11), and a first copper layer (12B) that is formed of copper or a copper alloy and is bonded to the first aluminum layer (12A) by solid-phase diffusion. The metal layer (13) has a second aluminum layer (13A) that is formed of aluminum or an aluminum alloy. The thickness (t1) of the circuit layer (12) and the thickness (t2) of the second aluminum layer (13A) of the metal layer (13) satisfy the relation t1 < t2.
Inventors:
NAGATOMO YOSHIYUKI (JP)
TERASAKI NOBUYUKI (JP)
KUROMITSU YOSHIROU (JP)
TERASAKI NOBUYUKI (JP)
KUROMITSU YOSHIROU (JP)
Application Number:
PCT/JP2014/058132
Publication Date:
October 02, 2014
Filing Date:
March 24, 2014
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/373; H01L25/07; H01L25/18
Foreign References:
| JP2012064801A | 2012-03-29 | |||
| JPS58181771A | 1983-10-24 | |||
| JPH04162756A | 1992-06-08 | |||
| JP3171234B2 | 2001-05-28 | |||
| JP2002076551A | 2002-03-15 |
Other References:
See also references of EP 2980844A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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