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Title:
SUBSTRATE FOR PRESSURE-SENSITIVE ADHESIVE TAPE, PRESSURE-SENSITIVE ADHESIVE TAPE, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/049565
Kind Code:
A1
Abstract:
Provided is a substrate for pressure-sensitive adhesive tapes which is thin and, despite this, can inhibit a water-based undercoating agent applied thereto from suffering cissing. The substrate for pressure-sensitive adhesive tapes provided by the present invention comprises 100 parts by mass of a poly(vinyl chloride) resin having an average degree of polymerization of 1,200-1,800, 25-75 parts by mass of a plasticizer, and 5-40 parts by mass of an inorganic filler, wherein the inorganic filler has an average particle diameter of 0.05-0.8 μm. The substrate has a thickness of 40-80 μm.

Inventors:
KIMURA, Akiyoshi (Chiba Plant 6, Goi Minamikaigan, Ichihara-cit, Chiba 88, 〒2908588, JP)
HASUMI, Mizuki (Shibukawa Plant 1135, Nakamura, Shibukawa-cit, Gunma 20, 〒3778520, JP)
SAWAMURA, Syota (Chiba Plant 6, Goi Minamikaigan, Ichihara-cit, Chiba 88, 〒2908588, JP)
Application Number:
JP2018/028909
Publication Date:
March 14, 2019
Filing Date:
August 01, 2018
Export Citation:
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Assignee:
DENKA COMPANY LIMITED (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 38, 〒1038338, JP)
International Classes:
C09J7/24; B32B27/00; C08L27/06; C08L51/04; C09D5/00; C09D151/04; C09J7/38; C09J7/50
Foreign References:
KR20170028589A2017-03-14
CN101787248A2010-07-28
JPH04372679A1992-12-25
JP2003157737A2003-05-30
JPH1036784A1998-02-10
JP2002047460A2002-02-12
JPH10140118A1998-05-26
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (Hiroo-Building 4th Floor, 3-12-40 Hiroo, Shibuya-k, Tokyo 12, 〒1500012, JP)
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