SUBSTRATE FOR PRINTED WIRING BOARDS AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED WIRING BOARDS

Title:

SUBSTRATE FOR PRINTED WIRING BOARDS AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED WIRING BOARDS

Document Type and Number:

WIPO Patent Application WO/2016/104347

Kind Code:

A1

Abstract:

A substrate for printed wiring boards according to one embodiment of the present invention is provided with: a base film having insulating properties; and a metal layer that is laminated on at least one surface of the base film. A plurality of fine particles are interposed between the base film and the metal layer, and the fine particles are formed of a metal that is the same as the main metal of the metal layer or a metal compound thereof. It is preferable that the plurality of fine particles have an average particle diameter of from 0.1 nm to 20 nm (inclusive). It is preferable that the plurality of fine particles are composed of a metal oxide or a metal hydroxide. It is preferable that the plurality of fine particles are present between the base film and the metal layer in the form of a layer. It is preferable that the metal layer contains a metal grain layer that is formed by firing metal nanoparticles.

Inventors:

SUGIURA MOTOHIKO (JP)
KASUGA TAKASHI (JP)
OKA YOSHIO (JP)
UEMURA SHIGEAKI (JP)
PARK JINJOO (JP)
UEDA HIROSHI (JP)
MIURA KOUSUKE (JP)

Application Number:

PCT/JP2015/085454

Publication Date:

June 30, 2016

Filing Date:

December 18, 2015

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)

International Classes:

H05K3/38; H05K1/09; H05K3/24

Domestic Patent References:

WO2010122918A1	2010-10-28
WO2008013002A1	2008-01-31

Foreign References:

JP2012114152A	2012-06-14
JP2013064191A	2013-04-11
US20100025080A1	2010-02-04