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Title:
SUBSTRATE FOR PRINTED WIRING BOARDS AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED WIRING BOARDS
Document Type and Number:
WIPO Patent Application WO/2016/104347
Kind Code:
A1
Abstract:
A substrate for printed wiring boards according to one embodiment of the present invention is provided with: a base film having insulating properties; and a metal layer that is laminated on at least one surface of the base film. A plurality of fine particles are interposed between the base film and the metal layer, and the fine particles are formed of a metal that is the same as the main metal of the metal layer or a metal compound thereof. It is preferable that the plurality of fine particles have an average particle diameter of from 0.1 nm to 20 nm (inclusive). It is preferable that the plurality of fine particles are composed of a metal oxide or a metal hydroxide. It is preferable that the plurality of fine particles are present between the base film and the metal layer in the form of a layer. It is preferable that the metal layer contains a metal grain layer that is formed by firing metal nanoparticles.

Inventors:
SUGIURA, Motohiko (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
KASUGA, Takashi (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
OKA, Yoshio (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
UEMURA, Shigeaki (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
PARK, Jinjoo (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
UEDA, Hiroshi (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
MIURA, Kousuke (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
Application Number:
JP2015/085454
Publication Date:
June 30, 2016
Filing Date:
December 18, 2015
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (30 Hinokigaoka, Minakuchi-cho Koka-sh, Shiga 68, 〒5280068, JP)
International Classes:
H05K3/38; H05K1/09; H05K3/24
Domestic Patent References:
WO2010122918A12010-10-28
WO2008013002A12008-01-31
Foreign References:
JP2012114152A2012-06-14
JP2013064191A2013-04-11
US20100025080A12010-02-04
Attorney, Agent or Firm:
NAKATA, Motomi et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
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